Schematic Design

We design digital, analog, and mixed-signal schematics, starting from requirements and system architecture. We work primarily in Altium Designer/KiCad with strict ERC/DRC and defined power/signal rules. We select ESP32, STM32, and Microchip (PIC/AVR/SAMD) platforms, plus analog and power parts from Analog Devices and Texas Instruments (amplifiers, ADC/DAC, sensors, PMIC). We build high-quality symbol libraries with pin/metadata checks and engineer interfaces (SPI, I²C, UART, USB, CAN, Ethernet, RS-485, LVDS, audio) for reliability and testability.

We run SPICE simulations (small-signal, transient, Monte Carlo) to verify loop stability (compensation, phase/gain margin), filter responses, and tolerance margins. In analog sections we focus on noise, offsets, and bandwidth; in digital we ensure signal integrity and proper logic levels. We design power trees (buck/boost/SEPIC/LDO) with start-up analysis and current budgeting; we define ground partitioning, EMI/ESD protection, and filtering aligned with EMC best practices.

We operate a schematic revision system (Git-style versioning + reviews) with approval checklists and full change history. Every change undergoes peer review; releases are tagged and tied to artefacts (PDF, netlist, BOM). Deliverables include interface sheets, connector pinouts, signal lists, and DFT assumptions (test points, boundary-scan/JTAG). Hand-off to PCB is safe and production-ready from day one.

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PCB & Prototypes

We design PCBs from 1 to 12 layers with controlled impedance, full DFM/DFA, and testability planned as early as the schematic and design-rule stage. We handle high-speed interfaces (DDR, USB, Ethernet, LVDS), RF and mixed-signal paths, ensuring both signal and power integrity (SI/PI) and following EMC best practices. The stack-up is always agreed with the fabricator: dielectric and copper thicknesses, materials (FR-4 with appropriate Tg; for RF—low-loss laminates), as well as finishes (ENIG, HASL, OSP) and board thickness (e.g., 0.8–2.0 mm). We prepare panelization documents, impedance coupons, and complete manufacturing files.

Differential pairs are routed with strict control of impedance, length, and skew (e.g., DDR, RMII/RGMII, USB 2.0/3.x), maintaining continuous return paths and correct via transitions (via stubs, via-in-pad, stitching vias). In RF sections we design microstrip/stripline lines at 50 Ω/75 Ω, antenna keep-outs, matching networks, and shielding. For mixed-signal designs we separate grounds and power domains where needed, define proper planes, filtering, and star topologies.

Every PCB receives a complete 3D model (STEP) of all components—this enables collision and fit analysis with the enclosure, connectors, standoffs, and mechanical parts. We verify component heights, service clearances, hole/slot locations, cable routing, and precise alignment with the housing (front panels, panel-mount connectors, buttons, LEDs). We iterate the fit together with the mechanical team and, when necessary, recommend changes in the PCB or the enclosure. In parallel we engineer thermals: copper pours, thermal vias, heat spreading, copper balancing, and warpage control.

We provide rapid prototypes and SMT/THT assembly in lead-free (RoHS) technology, with solder-paste/stencil optimization (aperture tuning), reflow profiles, and X-ray inspection for BGA/QFN. We design test points, netlists for ICT/bed-of-nails, boundary-scan/JTAG, and custom functional test fixtures. We handle bring-up and laboratory verification (power rails, communications, interfaces, parametric measurements).

For volume we deliver a complete package: Gerber/ODB++, fabrication and assembly drawings, a BOM with approved alternates and availability status, pick-and-place files, work instructions, and assembly notes (polarities, soldering order, masks). We follow IPC standards (e.g., IPC-2221, IPC-7351 for footprints) and prepare the design for EMC/ESD and safety requirements (mains clearance/creepage, galvanic isolation). Finally, we support the ramp to production—from pilot runs, through process refinement, to stable mass manufacturing.

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Mass Production

We run production with EMS partners: SMT/THT, AOI/ICT/FCT, lot tracking and complete docs (Gerbers, BOM, pick&place, work instructions). We oversee quality, issue resolution, packing and logistics. We scale from prototype to thousands while controlling cost and schedule.

On request we design and manufacture enclosures — from industrial design and 3D models (STEP), through prototypes, to series: plastic injection (DFM, resin selection, tooling), sheet metal (cut/bend/paint), CNC, and 3D printing for short runs. We provide finishing (anodizing, paint, UV/silkscreen), front panels and precise fit with PCB/connectors; we support IP/EMC/ESD validation and certification documentation.

Kitting & packaging: cable harnesses (connectors, ferrules, braid/heat-shrink), labeling (barcodes/QR, serial numbers), manuals and accessory kits. We prepare retail and bulk packaging (including ESD), inserts/foam, and product cards. We handle pre-assembly, calibration, burn-in, test reports and fulfillment with direct shipping to the end customer.

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Embedded Programming

We build firmware in C for STM32/ESP32 and other MCUs (ARM Cortex-M, Xtensa). We design a modular architecture (hal/ll → drivers → services → app logic), use RTOS (e.g., FreeRTOS) where appropriate, and event/ISR-driven flows for safety-critical parts. We implement SPI, I2C, UART, USB, CAN, Ethernet, BLE, Wi-Fi, motor control (PWM/FOC), sensor handling and power management (sleep/stop modes). We focus on non-blocking I/O, DMA, buffering and fault-tolerance.

We develop portable, testable I2C and SPI drivers: unified interfaces (init/read/write), transport abstractions, state & timeout handling, retries and error detection (NAK, CRC), including configuration auto-detection. We integrate sensors (IMU, temperature, pressure), memories (EEPROM/FRAM/Flash), ADC/DAC, GPIO expanders, displays, RTCs and radios. On STM32 we use HAL/LL or bare-metal layers; on ESP32 we target ESP-IDF. We add bootloaders and OTA (with signature verification), resource versioning and configuration migrations.

Quality first: unit tests (Unity/CMock), integration and HIL tests, asserts and watchdog. For debugging we rely on SWD/JTAG, trace & live-watch, UART/RTT logging, and logic analyzers. We profile timing (counters/timers, DWT), diagnose hard faults and capture crash dumps. We maintain consistent code style, code reviews, checklists, and a CI pipeline that builds multiple variants and publishes artifacts.

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Android Apps

We develop Android apps with Flutter/Dart (single codebase; optional iOS). We design intuitive UIs using Material 3, light/dark themes, responsive layouts, and accessibility. We deliver real-time charts, diagnostics, and offline data logging with sync once connectivity is restored.

Connectivity: BLE (GATT) pairing/bonding, MTU, notifications/indications, scan filtering, background mode; Wi-Fi provisioning (SoftAP), local discovery (mDNS), TCP/UDP; MQTT QoS 0/1/2, retained, LWT, keep-alive. We also integrate WebSocket and REST/JSON. We handle device OTA (BLE/Wi-Fi), checksum/version checks, and safe resume.

Data & security: REST/GraphQL/gRPC integrations, OAuth 2.0/OIDC/JWT sign-in, encryption and secure secrets (Android Keystore), runtime permissions, privacy policies. We add FCM, QR scanners, camera/gallery, CSV/JSON export and PDF reports. We use BLoC/Riverpod, MVVM, and layered architecture.

Quality & ops: unit/widget/integration tests, UI golden tests, performance profiling, offline-first stores (SQLite/Drift or Hive). We set up CI/CD, telemetry and crash reporting, and publish to Google Play or internal channels.

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PC/Windows Apps

We build C# / Python / C++ / Rust desktop apps for device control, data acquisition/analytics, and industrial integration. We design operator-friendly UIs (WPF/WinUI), light/dark themes, user roles, and shop-floor reliability (watchdogs, auto-restart, recovery). Diagnostics include structured logs, tracing and crash dumps.

Connectivity: serial RS-232/485, USB (CDC/HID, DFU), TCP/UDP, Modbus RTU/TCP, OPC UA, MQTT, WebSocket, REST/gRPC. We build robust protocol drivers, command queues, acks/retries, and offline buffering. Service panels: firmware flashing, calibration, EOL tests, real-time charts, alarms and event logging.

Data & reporting: SQLite or PostgreSQL/MS SQL, ETL to data stores, exports to CSV/Excel/PDF, dashboards and scheduled reports. For high volumes we use streaming & rotation; for analytics we integrate Python or native modules.

We use Rust where we need maximum performance & memory safety (stream processing, codecs/parsers, low-level services). Via FFI we bridge Rust with C# or Python when appropriate. CI/CD, signed installers (MSI/EXE), and Windows policies keep deployments safe and repeatable.

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Backend & API

We build a backend that acts as an extension of your hardware. We ingest telemetry (MQTT/HTTP/WebSocket), validate frames, identify devices (IDs, certs/keys), version firmware and configurations, and store data in the right backends (e.g., PostgreSQL/Timeseries/InfluxDB) for charts, reports and alarms.

We expose robust APIs (REST/JSON, WebSocket, sometimes gRPC) for mobile, desktop and web dashboards. We account for hardware realities: connectivity drops, buffering, acknowledgements, retries, limits, plus OTA workflows and secure update channels.

Security included: roles, tokens, rate limits, audit logs, and anti‑abuse filters (critical for public endpoints and forms).

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Frontend

We build operator panels and dashboards that help with bring‑up and maintenance: statuses, real‑time charts, alarms, reports, configuration and permissions. The UI is tied directly to device logic: calibration, functional tests, log viewing, comms diagnostics and version control (hardware/firmware).

The interface can be a standard web app, a service panel on a laptop, or even a browser-based HMI. We support dark/light mode, PL/EN and responsive layouts.

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Docker Deployments

We containerize the full stack: backend, databases, MQTT broker, reverse proxy (Nginx/HTTPS), monitoring and backups. With Docker/Compose deployments are repeatable on VPS and on‑prem — easy to reproduce, update and scale.

For hardware projects this is critical: you get a consistent “device backend” whether the customer runs it on-site or in the cloud. We add hardening (rate limits, headers, mail-sending restrictions, logs and alerts) so bots can’t abuse your domain or server.

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Project Analysis

We assess technical feasibility: system architecture, platform choices (MCU/SoC, connectivity, power), component availability, environmental and regulatory constraints. We define scope and limits (power, EMC noise, accuracy, energy), and validate ideas via PoC and quick simulations (SPICE/thermal) to reduce early risk.

We analyze risks (SI/RF/thermals), supply chain (EOL, lead time, alternates), manufacturing (DFM/DFA/DFT), certification (CE: EMC/LVD/RED/RoHS) and organization. We produce a risk register, milestones, critical path and entry/exit criteria. Resources & budget are estimated (CAPEX/OPEX, unit economics).

Phase plan: PoC → EVT → DVT → PVT, early EMC/ESD, DFM/DFT and KPI. IP screening and optional FTO. The final PDF is ready for grants and R&D planning: narrative, WBS, Gantt, budget/cash-flow, risk matrix, critical parts, supply chain, certification path and commercialization with a go/no-go.

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EU Funds

We advise on EU/regional programs, prepare applications, budgets and schedules, and support reporting after funding is granted. We minimize formal risks and ensure compliance.

We focus on the “Project description – electronics” section: electronic architecture (block diagram), functions, constraints and measurable KPIs. We attach schematic excerpts, SPICE results, PCB assumptions (stack-up, impedance, SI/PI, EMC/RF) and a 3D render with enclosure clash checks. Methodology covers phases, tests, DFM/DFA/DFT, CE path, BOM with alternates, costs and a milestone Gantt, plus innovation, TRL and commercialization plan.

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Commercialization

We cover the full commercialization track: sharpen value proposition, segment the market/ICP, choose revenue model (license/subscription/device+service) and compute unit economics. We design go-to-market routes (direct, distributors/OEM, integrators, online).

We secure IP (prior-art scan, preliminary FTO, patents/trademarks, trade secrets) and assemble the CE package (EMC, LVD, RED, RoHS/REACH, tech file, labels, DoC). In parallel we plan scale-up (pilot PVT, QA/QC, EOL tests, RMA/service, spares, multilingual manuals). A rollout plan with KPIs, campaign timeline, sales collateral and support flows completes the picture. For connected devices we include cybersecurity (OTA, signing, vulnerability policy). Partnerships with industry and research accelerate certification, production and distribution.

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3-Phase Motor Controller

Controller with FOC, current sensing and protections (over-current/over-temp/under/over-voltage). STM32 + MOSFET/IGBT platform, CAN/RS485/Ethernet, power profiling, soft-start and diagnostics. Deployed in industrial machinery with high efficiency and reliability.

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Ultrasonic Rangefinder

Time-of-Flight device with ±2 mm accuracy and up to 10 m range. Compact IP-rated enclosure, UART/RS485 interface and environmental noise filtering. Applications: warehouse automation, mobile robotics, parking systems.

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ModBUS ↔ Ethernet Gateway

A gateway converting Modbus RTU (RS485) to Modbus TCP/Ethernet based on STM32 with MAC. Supports many slaves, request queuing, watchdog and safe updates. Integrates legacy lines with SCADA and IoT cloud.

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CubeSAT – 5.8 GHz transceiver

A 5.8 GHz downlink module engineered for CubeSAT-class spacecraft. The RF chain uses a PLL/VCO locked to a TCXO reference, a low-noise driver and a power amplifier with impedance-matching network, band-pass filtering and harmonic traps. The logic layer provides telemetry, output-power control (AGC/APC), power management (low-power modes) and fail-safe features (watchdog, safe mode, brown-out). Interfaces include CAN / UART / SPI, with optional cold redundancy.

We ensured EMC/ESD robustness, ground partitioning and thermal stability (thermal derating) with temperature sensors near the PA and VCO. Thermal analyses and energy budgeting were performed for day/night cycles, along with a full link budget considering patch-antenna gain, polarization and feeder losses. The transmitter firmware handles framing, bitrate control, FEC and housekeeping telemetry. Safety measures include EIRP limits and PA current limiting.

Verification: EVM/ACLR and spectral-mask measurements, frequency stability vs. temperature, vibration & shock tests, thermal chamber trials and RNSS interferer resilience checks. We integrated with a patch antenna (VSWR, near-/far-field) and characterized radiation patterns across frequency and temperature. Sleep/hot-restart procedures and safe configuration updates in orbit were implemented.

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FAQ – Frequently Asked Questions

What services do you provide?

Schematic design (digital/analog/mixed-signal), PCB & prototypes, volume manufacturing (EMS), firmware (STM32/ESP32), Android & PC/Windows apps, and EU program support.

Do you prepare manufacturing documentation?

Yes — Gerber/ODB++, BOM with alternates, fabrication & assembly drawings, pick-and-place files, and ICT/FCT test instructions.

Do you support EU funding applications?

Yes — from matching calls and writing proposals to budgets/schedules and post-award reporting.

Do you design enclosures and manage kitting?

On request we design & manufacture enclosures (injection, sheet metal, CNC, 3D print) and handle kitting, labeling, packaging and fulfillment.

Electronics design. Do you offer end-to-end delivery?

Yes. We deliver end-to-end: concept & architecture → schematics, PCB, prototypes & firmware (STM32/ESP32) → testing, manufacturing docs, CE support, and volume ramp-up.

Do you collaborate with other companies for design support?

Yes. For selected projects we partner with specialists in automotive embedded, including DreamTools.it. Scope covers OBD, UDS (ISO 14229), ISO-TP (ISO 15765), FlexRay, DoIP, ECU/engine control integration for car/vehicle systems, diagnostic testing, and validation support.

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